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Plastic is the prevailing component in the field of office communications.
Some parts of these devices are exposed to enormous stress in terms of pressure, heat, or driving forces during operation. To ensure that every single component and thus the complete device can cope with the high requirements of daily use, we apply various techniques to injection molding processes: Thin-wall technology, magnetization of the plastic component in-mold, and dispension of seals.
By using these technologies we guarantee to deliver flawless and cost-efficient components to our customers. We therefore contribute to resulting products which are user friendly and easy to maintain.
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Communication devices 
